Current Working Papers

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Current Working Papers

🔬 RealSoS Engine

  • 388 [Dynamic Intelligence and Connectivity in the Edge–Cloud Continuum] Nerves of the Semiconductor Smart Fabs: Time-sensitive Dynamic Intelligence for Both Yield and SSbD Compliance
    • To manage sub-2nm angstrom-scale fabrication complexities, this pillar transitions industrial edge-cloud systems into a Cognitive Computing Continuum (CCC) that handles both production performance and environmental parameters simultaneously. It formalizes a socio-technical governance layer called the SIPAEA (Sense-Interpret-Plan-Act-Evaluate-Adapt) framework to extend traditional reactive automation into multi-loop reflective governance. This “Atoms-to-Law” framework integrates Virtual Metrology (VM) for atomic process modeling with Cognitive Soft-Sensing for resources such as water reclamation systems, matching extreme precision metrics with real-time legal obligations.
    • Deliverables:
      • D2.1: SIPAEA Multi-Loop Cybernetic Control Engine – Software orchestration stack deployed across edge-cloud clusters to execute real-time balancing between chip operational yield and environmental thresholds.
      • D2.2: Cognitive Soft-Sensing Toolkit for Resource Circularity – Predictive modeling suite trained on fab facility data to track real-time chemical and water reclamation cycles, establishing verifiable ESG metrics, allowing yield-waste-emission harmonization.
  • 286 [TEC - TECHNOLOGY] Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD
    • This pillar delivers a comprehensive systematic review mapping the “core-periphery” knowledge structures across 1,465 baseline academic and industrial source documents to uncover critical technology gaps in semiconductor lifecycles. It assesses the current landscape of global RegTech platforms—such as EcoVadis, IntegrityNext, and Workiva—revealing a significant architectural deficit regarding specialized metrology data integration and standard alignment. The resulting meta-framework connects industrial analytics with international sustainability mandates (e.g., ITU-T L.1470/L.1480, IEEE 7000) to construct an interoperable System of Systems (SoS) approach for semiconductor manufacturing.
    • Deliverables:
      • D3.1: Semiconductor Metrology-ESG Knowledge Map & Repository – An indexed, open-access database compiling bibliometric data, knowledge graphs, and evaluated compliance deficits across international fab platforms.
      • D3.2: Layered SSbD architecture for the Semiconductor Industry — a first-iteration harmonization of the SSbD Stakeholder Agenda and IRDS roadmaps     -
      • D3.3: Unified Interoperable SSbD Standards Harmonization Matrix – Cross-mapping framework translating physical metrology signals and Virtual Metrology outputs directly into audit-ready metrics for EU CBAM and REACH compliance.

🛡️ GuardSoS Gateway

  • 372 [Trustworthy Autonomous AI for Digital Transformation] Scaling Autonomous AI Agents as Regulatory Proxies in Industrial Data Spaces: Architecting Trust in Smart Fab Operations
    • This pillar establishes a shift from static automation to active regulatory agency within advanced fabrication facilities through autonomous agentic workflows termed “Professional Proxies”. Engineered to operate inside the International Data Spaces (IDS) framework, these proxies act as specialized digital stewards managing environmental substance substitutions, privacy-preserving operations, and automated emissions tracking. By combining Policy-as-Code with hardware-rooted trust such as Trusted Execution Environments (TEEs), this architecture resolves the data sovereignty paradox, enabling factories to share audit-ready compliance reporting across fragmented borders without leaking intellectual property or proprietary telemetry.
    • Deliverables:
    • D1.1: IDS Professional Proxy Reference Implementation Framework – A containerized agentic platform combining Policy-as-Code engines and hardware-rooted TEE configurations to automate CSDDD compliance across semiconductor cross-border hubs.
    • D1.2: Sovereign Data Fabric & Multi-Steward Connector Architecture – Operational IDS-certified data space connectors deploying specific environmental, privacy, and digital auditing workflows for the EU-Hsinchu-Penang manufacturing corridor.
  • Also 306 and 286

♻️ AuditSoS Framework

  • 306 [INN - INNOVATION] Orchestrating the Twin Transition in Multinational Corporations: Technology Roadmapping for Green and Digital Global Business Services
    • This pillar reframes Global Business Services (GBS) as a primary socio-technical “living laboratory” and “operational airlock” managing the Twin Transition across multinational corporation value chains. Utilizing Technology Roadmapping (TRM) and the ITU ICT-centric innovation ecosystem toolkit, the research charts an evolutionary shift toward “Sustainable Intelligence” within service delivery networks. It highlights how critical middle-power digital ecosystems—specifically in Poland, Portugal, and Malaysia (GBS 5.0)—leverage advanced engineering talent to bypass middle-income traps and anchor global manufacturing flows amid geopolitical fractures.
    • Deliverables:
      • D4.1: Middle-Power GBS Twin Transition Roadmap – A strategic playbook defining the integration of AI-native workflows, fintech layers, and green ICT investments tailored for regional hubs.
      • D4.2: GBS Stakeholder Engagement Canvas & Innovation Toolkit – An operational canvas designed to orchestrate talent upskilling, cross-border carbon border adjustment data aggregation, and ecosystem co-creation models.
  • 401 [Digital Circular Economy] From Stacks to Circuits: A Regenerative Socio-Technical Roadmap for AI Infrastructure within Planetary Boundaries
    • This pillar challenges the dominant, linear “electrons-to-tokens” scaling trajectory of current Generative AI stacks by presenting a competing reference architecture that models AI infrastructure through a circular lens. Integrating the Sustainable Production and Consumption (SPaC) mapping system alongside the quantitative facility targets of the IEEE IRDS™ roadmaps, it establishes a Regenerative Socio-Technical (RST) framework. The resulting model converts thermodynamic entropy, material waste, and Scope 3 lifecycle metrics into dynamic regeneratively accountable and environmentally safe semiconducer supply chains, internalizing ecological debt straight onto institutional balance sheets.
    • Deliverables:
      • D5.1: Regenerative Socio-Technical AI Reference Architecture – An alternate technical blueprint mapping AI infrastructure flows from “Atoms to Values” instead of simple energy consumption.
      • D5.2: Metrology-Grounded Digital Product Passport (DPP) Schema – A standardized metadata schema for hardware lifecycles tracking physical material footprints, cooling-water energy connections, and electronic recycling pathways.

🦾 Skills 💪

  • 999 Skills.md Orchestrating Sustainable AI and Semiconductor Ecosystems: RegTech & FinTech Frameworks
  • This module outlines the foundational research paradigms, educational components, engineering innovations, and structural competencies required to run the specialized manufacturing services generated under the SCVCS research infrastructure.

Notes. on the Proposal

  • submission-aligned with the updated Horizon Europe 2026–2027 Standard Application Form for Research and Innovation (R&I) Actions
  • including the streamlined Impact Section (2.1) where general scientific/economic/societal impact breakdowns
  • shortened table requirements in the Implementation criteria

Notes to self

Adding publications

use just newpub for creation of new directory and input prompts for new record. ### Adding new people use just newperson for creation of new directory and input prompts for new record. ### Deployment - use long-running updates branch for deploy previews - quarto render locally and include _site in version control - GitHub action scp-to-server.yml deploys to serverv